Scribing Tools

Diamond Scribe Tool

We offer a wide selection of diamond scribe tools from Tecdia. Tecdia scribe tools are designed for longevity and maximum wafer singulation yield. Extensive array of 2, 3, 4 and 8 cut-point tools that are suited for wafer thicknesses from 50-500 microns.

Featuring dry cut solution: Scribe and break
Die singulation performed with a diamond scribe and break process has distinct advantages over conventional saw or laser dicing methods. Scribe and break is inherently a dry process which generates virtually zero heat and requires no liquid coolants that can potentially damage sensitive structures.

View our standard wafer scribing tools selection guide.

Custom designed tools to cover your specific needs are available. Contact us for more information.


Handy Wafer Scriber Kit – Manual Scribing System

It is ideal for educational and commercial research, to easily scribe a variety of wafer materials up to 3 inches in diameter. Requiring no formal training nor complicated setup.


  • Suitable for scribing InP, Glass, GaAs, Si, SiO2, Sapphire and SiC wafers up to 3 inches in diameter.
  • Cut point types: 3-Point, 4 Point
  • Predetermined scribing angle for optimal results
  • Two-part design with non-slip surface holds wafers firmly while scribing.
  • Unique pen design enables uniform scribing pressure.

Handy Wafer Scriber Kit consists of

Description Qty
Pen Fixture 1 pc
TD-3YP-H Scribe tool 1 pc
TD-4PB Scribe Tool 1 pc
Round TD-3YP-H Angle Setter 1 pc
Square TD-4PB Angle Setter 1 pc
Base Plate 1 pc
Guide Plate (slotted) 1 pc
Carrying Case 1 pc
Instruction Manual 1 pc

Handy Wafer Scriber Kit Catalog